Hydroxyethyl acrylate

Application Fields

Relying on the dual function of "double bond polymerization + hydroxyl crosslinking," HEA is widely used in scenarios requiring crosslinking modification, hydrophilicity adjustment, or enhanced reactivity:

Coatings and Inks Industry:

UV-curable coatings: As a reactive diluent, it works with photoinitiators to polymerize rapidly under ultraviolet light (curing time < 10 seconds). Used for furniture and plastic coatings, it offers both high gloss (60° gloss > 95) and scratch resistance (pencil hardness ≥ 2H).

Water-based coatings: Copolymerized with acrylics to introduce hydroxyl groups and increase crosslinking density, significantly improving water resistance (no blistering after 240 hours of immersion) and weather resistance (no chalking after 1000 hours of QUV aging). Suitable for building exterior walls and automotive primers.

Adhesives and Sealants:

Reacts with polyurethane prepolymers; through hydroxyl and -NCO crosslinking, it prepares high-performance structural adhesives for metal-plastic bonding (shear strength > 15 MPa), with a temperature resistance range of -40~120℃.

As a modifier for pressure-sensitive adhesives, it introduces hydroxyl groups to increase adhesion to polar substrates (such as glass and aluminum), increasing peel strength by over 30%.

Polymer Material Modification:

Water-based resins: Copolymerization modification of polyacrylate emulsions; hydroxyl groups participate in crosslinking to enhance solvent resistance of the resin film after formation (resistant to > 50 ethanol wipes). Used for leather finishing and fabric finishing.

Medical polymers: Copolymerized with N-vinylpyrrolidone (NVP) to prepare hydrogels; hydroxyl groups impart hydrophilicity and biocompatibility to the material. Used for contact lenses and wound dressings (water absorption can reach 500% of self-weight).

Other Fields:

As an oilfield chemical, used to prepare fracturing fluid thickeners; hydroxyl groups enhance adsorption to formation rocks, improving fracturing efficiency. Synthesizes photosensitive resins for printed circuit board photoresists; precise patterns are formed after double bond photosensitive polymerization (resolution up to 50μm).